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Semester 1 08O101 calculus and its applications 3 2 0 4 basic concepts


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08O021 COMPOSITE MATERIALS


3 0 0 3

INTRODUCTION: Reinforcement – Fibres – Glass fibre, Aramid fibre, Carbon fibre, boron fibre – Fabrication – Properties – Applications – Comparison of fibres – Particulate and whisker reinforcements. Matrix materials – Properties. (7)
REINFORCEMENT – MATRIX INTERFACE: Wettability – Effect of surface roughness – Interfacial bonding – Methods for measuring bond strength. (5)

POLYMER MATRIX COMPOSITES: Types – Processing – Thermal matrix composites – Hand layup and spray technique, filament winding, Pultrution, resin transfer moulding, autoclave moulding – Thermoplastic matrix composites – Injection moulding, film stacking – Diaphragm forming – Thermoplastic tape laying. Glass fibre/polymer interface. Mechanical properties – Fracture. Applications. (7)
METAL MATRIX COMPOSITES: Types. Important metallic matrices. Processing – Solid state, liquid state, deposition, insitu. Sic fibre / Titanium interface. Mechanical properties. Applications. (6)

CERAMIC MATRIX COMPOSITES: Ceramic matrix materials – Processing – Hot pressing, liquid infiltration technique, Lanxide process, insitu chemical reaction techniques – CVD, CVI, sol gel process. Interface in CMCs. Mechanical properties – Thermal shock resistance – Applications. (7)
GEOMETRICAL ASPECTS: Unidirectional laminas – Volume fraction and weight fraction – Woven roving, in-plane random fibres – Fibre length and fibre orientation distribution – Voids – Fibre orientation during flow. (5)

FATIGUE AND CREEP IN COMPOSITE MATERIALS: Fatigue – S-N curves – Fatigue behaviors of CMCs – Fatigue of particle and whisker reinforced composites – Hybrid composites – Thermal fatigue – Creep. (5)

Total 42


REFERENCES:

  1. Mathews F L and Rawlings R D, “Composite Materials: Engineering and Science”, CRC Press and Woodhead Publishing Limited, 2002.

  2. Krishnan K Chawla, “Composite Materials Science and Engineering”, Springer, 2001.

  3. Handbook of Composites – American Society of Metals, 1990.

  4. Derek Hull, “An introduction to Composite Materials”, Cambridge University Press, 1988.

08O022 ELECTRONIC CERAMICS

3 0 0 3

STRUCTURE OF CERAMIC MATERIALS: Pauling’s rule – Oxide structures Silicate structures – Clay minerals – polymorphism: displacive transformations, reconstructuve transformation, Silica. (8)



STRUCTURE OF GLASSES: Glass formation – Random network model – structure of oxide glasses – glass formation – composition as a variable, heat flow and precipitation from glasses – growth controlled by diffusion of solutes – crystalline glasses – enamels – photosensitive and photochromic glasses. (9)
OUTLINE OF ELECTRICAL PROPERTIES: Conductivity of ceramic materials – ceramic semiconductors and their uses as fixed resistors, heating elements, thermistors and varistors – piezoelectric ceramics – insulators. (6)

DIELECTRIC MATERIALS: Electronic, ionic, orientation and space charge polarization mechanisms. Electrical properties such as capacitive loss, dielectric conductivity and dielectric strength. Structural dielectric materials. Ferroelectric theory, ferroelectric state based on local field. Effects of temperature, environment, composition and grain size. Anti-ferroelectric and ferroelectric transition. (8)

PIEZOELECTRIC CERAMICS: Parameters for piezoelectric ceramics and measurement. General characteristics and fabrication of PZT. Applications. (5)

ELECTRO-OPTIC CERAMICS: Birefringence. Non-linear effects in large electric fields. pockets effect. Kerr effect. Second harmonic generation. Measurement of electro-optic properties . Applications. (6)

Total 42

REFERENCES:

  1. Moulson A J and Herbert J M, “Electro Ceramics”, Ed. 2, John Wiley & Sons Ltd., 2003.

  2. William F Smith, “Foundations of Materials science and Engineering”, McGraw Hill Book Co., 2000.

  3. Michel W Barsoum, “Fundamentals of Ceramics”, McGraw Hill Book Co., 1997.

  4. Kingery, “Introduction to Ceramics”, John Wiley Publications, 1991.

  5. Van Vlack, “Physical Ceramics for Engineers”, Addison Wesley, 1964.

08O023 PLASMA TECHNOLOGY

3 0 0 3
DISCHARGE PHYSICS AND GLOW DISCHARGE: Types of Discharges: AC and DC discharges - glow - arc - corona - rf - ecr discharges - conduction in ionized gases. Diffusion: Diffusion and mobility - mean fee path and collision frequency - free diffusion - mobility - ambipolar diffusion - transition diffusion - diffusion in magnetic field and fully ionized plasma. General structures and features: V-I characteristics - cathode layer - positive coloumn - discharge in fast gas flow - glow discharge instabilities and their consequences - thermal stability. (10)

ARC DISCHARGE: Definition and characteristics - features of arc discharge - types of arcs, high intensity arcs - classification of arcs- free burning arc - wall, vortex, electrode, forced convention and magnetically stabilized arcs - Non thermal arcs; low pressure and low intensity arcs - initiation of arcs - low pressure arc with externally heated cathode - plasma temperature - V-I characteristics - electron and gas temperatures. (8)

Thermally induced random motion of particles - distribution of temperature and velocity in a gas - ionization of atoms and molecules - Saha equation - degree of ionization - electron concentration - thermodynamic equilibrium of plasma in an electrical discharge - definition of thermodynamic properties of plasma. (7)


LABORATORY PLASMA SOURCES/DEVICES: Low temperature plasma generation - transferred and non-transferred arc torches and their characteristics - heat transfer efficiency of plasma torches - design accepts - special type of torch for metallurgical applications - vacuum plasma torches - rf torch and their characteristics. (7)
APPLICATIONS: Plasma spraying of ceramic, alloys and metals - vacuum spraying - plasma reduction of ores and minerals - plasma disassociation of compound oxides - plasma refining and remelting - plasma furnace in steel making - plasma cutting - sputtering - plasma enhanced chemical vapour deposition - plasma nitriding and surface cleaning. (7)

PLASMA DIAGNOSTICS: Electrical probe techniques - spectroscopic methods - charged particle methods - energy balance technique. (3)

Total 42

REFERENCES:

1. Taritkumar Bose, “High Temperature Gas Dynamics”, Springer, 2004.

2. Brown S C, “Introduction to Electrical Discharge in Gases”, John Wiley, New York, 1996.

3. Yuri P Raizer, “Gas Discharge Physics”, Springer – Verlag, Berlin, 1991.

4. Rossnagel S M, Cuomo J J and Westwood W D, “Handbook of Plasma Processing Technology”, William Andrew Publishing, 1990.

5. Plasma Metallurgy, “The Principles of Materials Science Monographs”, 23, Vladmir Dembovsky, Elsevier Science, Jan. 1985.

6. Francis F Chen, “Introduction to Plasma Physics”, Plenum press (New York), 1984.

7. George Schmidt, “Physics of High Temperature Plasma”, Academic press, New York, 1979.

8. Dresvin S V and Donskoi A V, “Physics and Technology of Low Temperature Plasmas”, John Wiley and Sons, 1977.

9. Lochite W and Holtgrevan, “Plasma Diagnostics”, North Holland Publishing Company, 1968.

10. “Plasma Physics and Controlled Nuclear Fusion Research”, Vol. 1, 2 & 3, IAEA Publication.

11. “Plasma Processing and Synthesis of Materials”, Materials Research Society Symposia Proceedings, Vol. 30.


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