Semester 1 08O101 calculus and its applications 3 2 0 4 basic concepts

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REFERENCES:

1. Saeed Ghahramani, “Fundamentals of Probability with Stochastic Processes”, Prentice Hall, 2005.

2. Sheldon M Ross, “Stochastic Processes”, John Wiley & Sons, Inc., 2004.

3. Sheldon M Ross, “Introduction to Probability Models”, Academic Press, 2003.

4. Medhi J, “Stochastic Processes”, New Age International Publishers, 2002.

5. Samuel Karlin and Howard E Taylor, “A First course in Stochastic Processes”, Academic Press, 2002.

6. D L (Paul) Minh, “Applied Probability Models”, Duxbury Thomson Learning, 2002.

7. Gross D and Harrish C M, “Fundamentals of Queuing Theory”, John Wiley & Sons, New Delhi, 1998.

08O007 DATABASE SYSTEMS

3 1 0 3.5
INTRODUCTION: Purpose of Database system - Characteristics of database approach - Advantages of using DBMS - Database concept and architecture - Data Abstraction - Data Models - Instances and schema - Data independence - schema architecture - Database Languages - Database Manager - Database Administrator - Database Users. (6)
DATA MODELING: Entity sets attributes and keys - Relationships (ER) - Database modeling using entity - Type role and structural constraints - Weak and Strong entity types - Enhanced entity-relationship (EER) - Entity-Relationship Diagram Design of an E-R Database schema – Object modeling - Specialization and generalization - Modeling of union types. (5)

RELATIONAL MODEL: Relational model -basic concepts - Enforcing Data Integrity Constraints – Relational Algebra Operations - Extended Relational Algebra Operations - Relational Calculus - Assertion and Triggers - Introduction on views - Introduction to SQL – Basic queries in SQL - Advanced queries in SQL - Functions in SQL - Basic data retrieval - Aggregation – Categorization - Updates in SQLs - Views in SQL - Different types of views - Theoretical Updatability of Views. (8)
DATABASE DESIGN: Database design process - Relational database design - Relation Schema - Anomalies in a database - Functional dependencies - Membership and minimal covers - Normal forms - First Normal Form - Second Normal Form - Third Normal Form - Boyce-Codd Normal form - Reduction of an E-R schema to Tables - Converting EER Diagrams to relations - Practical database design tuning - Effect of de-normalization on database performance. (8)

FILE ORGANIZATION, INDEXING AND HASHING: Overview of file organization techniques - Secondary storage devices - Operations in files - Heap files and sorted files - Basic concepts Indexing and Hashing – Basics of RAID technology. (6)
OBJECT ORIENTED DATABASE DESIGN: Introduction OODBMS - Approaches to OODs - Object oriented data model - Object identity - Complex Objects - Persistence - Type and class hierarchies - Inheritance - Modeling and designing of OODs – OODBMS for CAD / CAM application. (6)
CASE STUDY ON POPULAR DATABASE PACKAGES: Oracle – Implementation of CAD / CAM design data in Oracle database. (3)
Total 42

REFERENCES:

1. Date C J, “An Introduction to Database Systems”, Pearson Education Asia, 2005.

2. Elmasri R and Navathe S B, “Fundamentals of Database Systems”, Addison Wesley, 2004.

3. Raghu Ramakrishnan, “Database Management Systems”, McGraw Hill, 2004.

4. Silberschatz, Korth H and Sudharshan S,” Database System Concepts”, McGraw Hill, 2003.

5. Graeme C Simsion, “Data Modeling Essentials”, Dreamtech, 2001.

08O008 MATHEMATICAL MODELING FOR MECHANICAL SCIENCES

3 1 0 3.5
INTRODUCTION: General consideration of modeling: Basic concepts of fluid flow, derivation of the governing equations, conservation of mass, momentum, numerical methodology, discrimination, grid formation. (7)

FLUID DYNAMICS: Properties of fluids, basic concepts, Types of flow, continuity equation, derivation of three dimensional equations, momentum equation, Nevier Stoke’s equation, Euler’s equation, Bernoulli’s energy equation - Boundary layer theory, Introduction to computational fluid dynamics, FEM and FVM techniques, applications of fluid Dynamics. (14)

FLOW MODELING: Laminar flow between plates, Covette, and plane Poiseuille, Turbulence energy equation-one equation model, the

model, the

model. (11)

MATHEMATICAL MODELS: Modeling free vibration, the classical equations, the vibrating string membrane, waves in an elastic medium, conduction of solids in the circular membrane, the gravitational potential, some problems. (10)

Total 42

REFERENCES:

1. Pieter Wesseling, “Principles of Computational Fluid Dynamics”, Springer, 2004.

2. Chung T J, “Computational Fluid Dynamics”, Cambridge University Press, London, 2002.

3. David C Wilcox, “Turbulence Modeling for Computational Fluid Dynamics”, DCW Industries Inc, 1993.

4. Batchelor G K, “Fluid Dynamics”, Cambridge University Press, 1993.

PHYSICS

08O016 MICRO MACHINING AND MICRO SENSORS

3 0 0 3

MEMS AND MICROSYSTEMS: MEMS and microsystem products. Evaluation of microfabrication. Microsystems and microelectronics. Applications of microsystems. Working principles of microsystems - microsensors, micro actuators, MEMS and microactuators, microaccelerometers. (5)
SCALING LAWS IN MINIATURIZATION: Introduction. Scaling in geometry. Scaling in rigid body dynamics. The Trimmer force scaling vector – scaling in electrostatic forces, electromagnetic forces, scaling in electricity and fluidic dynamics, scaling in heat conducting and heat convection. (5)

MATERIALS FOR MEMS AND MICROSYSTEMS: Substrates and wafers. Silicon as a substrate material. Ideal substrates for MEMS. Single crystal Silicon and wafers crystal structure. Mechanical properties of Si. Silicon compounds - SiO₂, SiC, Si₃N₄ and polycrystalline Silicon. Silicon piezoresistors. Gallium arsenside. Quartz – piezoelectric crystals. Polymers for MEMS. Conductive polymers. (8)

MICROSYSTEM FABRICATION PROCESS: Photolithography. Photoresist and applications. Light sources. Ion implanation. Diffusion process. Oxidation – thermal oxidation. Silicon diode. Thermal oxidation rates. Oxide thickness by colour. Chemical vapour deposition – principle, reactants in CVD. Enhanced CVD physical vapour deposition. Sputtering. Deposition by epitaxy. Etching – chemical and plasma etching. (8)
MICRODEVICES: Sensors – classification of sensors – signal conversion – ideal characterisation of sensors – mechanical sensors – measurands – displacement sensors – pressure and flow sensors. (8)
MICROMANUFACTURING AND MICROSYSTEM PACKAGING: Bulk micromachining. Isotropic and anisotropic etching - wet etchants, etch stops, dry etching comparison of wet and dry etching. Dry etching – physical etching – reactive ion etching, comparison of wet and dry etching. Surface micromachining - process in general, problems associated in surface micromachining. The LIGA process – description, materials for substrates and photoresists, electroplating, the SLIGA process. Microsystem packaging - General considerations. The three levels of microsystem packaging – die level, device level and system level. Essential packaging technologies – die preparation – surface bonding, wire bonding and sealing. Three dimensional packaging. Assembly of microsystem – selection of packaging materials. (8)

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